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hlmp-hg63, hlmp-hm63, hlmp-hb63 precisionfopticalfperformancefred,fgreenfandfbluef f newf5mmfstandardfovalfleds data sheet description these precision optical performance oval leds are spe - cifcally designed for full color/video and passenger infor - mation signs. the oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide feld of view outdoor applications where a wide viewing angle and readability in sunlight are essential. the package epoxy contains both uv-a and uv-b inhibi - tors to reduce the efects of long term exposure to direct sunlight. applications ? full color signs features ? well defned spatial radiation pattern ? high brightness material ? available in red, green and blue color. red alingap 626nm green ingan 525nm blue ingan 470nm ? superior resistance to moisture ? standof package ? tinted and difused ? typical viewing angle 40 x100 package dimensions notes: all dimensions in millimeters (inches). tolerance is 0.20mm unless other specifed caution: ingan devices are class 1c hbm esd sensitive per jedec standard. please observe appropriate precautions during handling and processing. refer to application note an-1142 for additional details.
device selection guide part number color and dominant wavelength l d (nm) typ luminous intensity iv (mcd) at 20 ma-min luminous intensity iv (mcd) at 20 ma-max HLMP-HG63-TX0XX redf66 800 990 hlmp-hm63-y30xx greenf5 5 990 5040 hlmp-hb63-qu0xx bluef470 460 50 tolerance for each intensity limit is 15%. notes: 1. the luminous intensity is measured on the mechanical axis of the lamp package. absolute maximum ratings, t a = 25c parameter red blue and green unit dcfforwardfcurrentf [] 50 30 ma peakfforwardfcurrent 00f [] 00f [3,f4] ma powerfdissipation 0 mw reversefvoltagef 5f(i r f=f 00fa) 5f(i r f=f 0fa) v ledfjunctionftemperature 30 0 c operatingftemperaturefrange -40ftof+ 00 -40ftof+85 c storageftemperaturefrange -40ftof+ 0 -40ftof+ 00 c notes: 1. derate linearly as shown in figure 4 and figure 8. 2. duty factor 30%, frequency 1khz. 3. duty factor 10%, frequency 1khz. 4. for long term performance with minimal light output degradation, drive current below 15ma is recommended for blue led. part numbering system hlmp- h x 63 ? x x x x x packaging option zz: flexi ammopacks color bin selection 0: open distribution dd: ammopack maximum intensity bin refer to device selection guide minimum intensity bin refer to device selection guide. color b: blue 470 g: red 626 m: green 525 package h: 5mm standard oval 40 x100 note: please refer to ab 5337 for complete information about part numbering system.
3 electrical / optical characteristics, t a = 25c parameter symbol min. typ. max. units test conditions forwardfvoltage red green blue v f .8 .7 .7 . 3. 3. .4 3.7 3.7 v i f f=f0fma reversefvoltage red greenf&fblue v r 5 5 v i r f=f00f m a i r f=f0f m a dominantfwavelengthf [] red green blue 60 50 460 66 55 470 630 540 480 i f f=f0fma peakfwavelength red green blue l peak 634 56 464 nm peakfoffwavelengthfoffspectralf f distributionfatfi f f=f0fma thermalfresistance r q j-pin 40 c/w ledfjunction-tofpin luminousfefcacyf [] red green blue h v 50 530 65 lm/w emittedfluminousfpower/emittedf f radiantfpower luminousfflux red green blue j v 700 3700 990 mlm i f f=f0fma luminousfefciencyf [3] red green blue h e 40 60 6 lm/w luminousfflux/electricalfpower i f f=f0fma notes: 1. the dominant wavelength is derived from the chromaticity diagram and represents the color of the lamp 2. the radiant intensity, ie in watts per steradian, may be found from the equation ie = i v / h v where iv is the luminous intensity in candelas and h v is the luminous efcacy in lumens/watt. 3. h e = j v / i f x v f , where j v is the emitted luminous fux, i f is electrical forward current and v f is the forward voltage.
4 alingap red figure 1. relative intensity vs wavelength figure 3. forward current vs forward voltage figure 2. maximum forward current vs ambient temperature figure 4. relative intensity vs forward current 0 0.5 1 1.5 2 2.5 0 1 0 2 0 3 0 4 0 5 0 dc forward current - ma relative luminous intensity (normalized at 20 ma) 0 5 10 15 20 25 30 35 40 45 50 55 0 2 0 4 0 6 0 8 0 100 120 t a - ambient temperature - oc i f - forward current - ma 0.0 0.2 0.4 0.6 0.8 1.0 550 600 650 700 wavelength - nm relative intensity 0 10 20 30 40 50 0 1 2 3 forward voltage - v forward current - ma
5 ingan blue and green figure 5. relative intensity vs wavelength figure 6. forward current vs forward voltage figure 7. relative intensity vs forward current figure 8. maximum forward current vs ambient temperature figure 9. relative dominant wavelength vs forward current 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 0 5 10 15 20 25 30 forward current - ma relative luminous intensity - normalized at 20ma green blue 0 5 10 15 20 25 30 35 0 2 0 4 0 6 0 8 0 100 t a - ambient temperature - ?c i f max. - maximum forward current - ma 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 380 430 480 530 580 630 wavelength - nm relative intensity blue gree n 0 5 10 15 20 25 30 35 0 1 2 3 4 forward voltage - v forward current - ma -3 -2 -1 0 1 2 3 4 5 6 7 0 5 10 15 20 25 30 35 forward current - ma dominant wavelength shift- nm gree n blue
6 intensity bin limit table (1.2: 1 iv bin ratio) bin intensity (mcd) at 20 ma min max p 380 460 q 460 550 r 550 660 s 660 800 t 800 960 u 960 1150 v 1150 1380 w 1380 1660 x 1660 1990 y 1990 2400 z 2400 2900 1 2900 3500 2 3500 4200 3 4200 5040 tolerance for each bin limit is 15% figure 10. radiation pattern-major axis figure 11. radiation pattern-minor axis 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 3 0 6 0 9 0 angular displacement - degrees normalized intensity 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 -90 -60 -30 0 3 0 6 0 9 0 angular displacement - degrees normalized intensity vf bin table (v at 20ma) bin id min max vd .8 .0 va .0 . vb . .4 notes: 1. tolerance for each bin limit is 0.05v. 2. v f binning only applicable to red color.
7 green color bin table bin min dom max dom xmin ymin xmax ymax 50.0 54.0 0.0743 0.8338 0.856 0.6556 0.650 0.6586 0.060 0.89 54.0 58.0 0.060 0.89 0.068 0.6463 0.856 0.6556 0.387 0.848 3 58.0 53.0 0.387 0.848 0.73 0.6344 0.068 0.6463 0.70 0.7965 4 53.0 536.0 0.70 0.7965 0.469 0.63 0.73 0.6344 0.003 0.7764 5 536.0 540.0 0.003 0.7764 0.659 0.6070 0.469 0.63 0.96 0.7543 tolerance for each bin limit is 0.5nm blue color bin table bin min dom max dom xmin ymin xmax ymax 460.0 464.0 0.440 0.097 0.766 0.0966 0.88 0.0904 0.374 0.0374 464.0 468.0 0.374 0.0374 0.699 0.06 0.766 0.0966 0.9 0.0495 3 468.0 47.0 0.9 0.0495 0.66 0.09 0.699 0.06 0.87 0.067 4 47.0 476.0 0.87 0.067 0.57 0.43 0.66 0.09 0.063 0.0945 5 476.0 480.0 0.063 0.0945 0.397 0.78 0.57 0.43 0.093 0.37 tolerance for each bin limit is 0.5nm note: 1. all bin categories are established for classifcation of products. products may not be available in all bin categories. please contact your avago representative for further information. red color range min dom max dom xmin ymin xmax ymax 60 630 0.6904 0.3094 0.689 0.943 0.676 0.306 0.708 0.9 tolerance for each bin limit is 0.5nm.
8 avago color bin on cie 1931 chromaticity diagram relative light output vs junction temperature 0.000 0.200 0.400 0.600 0.800 1.000 0.000 0.100 0.200 0.300 0.400 0.500 0.600 0.700 0.800 x y green blue 1 2 3 4 5 5 4 3 2 1 red 0.1 1 10 -40 -20 0 2 0 4 0 6 0 8 0 100 120 tj - junction temperature - c relative light output (normalized at tj = 25c) red green blue
9 precautions: lead forming: ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering on pc board. ? for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. ? if manual lead cutting is necessary, cut the leads after the soldering process. the solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into led package. this is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. soldering and handling: ? care must be taken during pcb assembly and soldering process to prevent damage to the led component. ? led component may be efectively hand soldered to pcb. however, it is only recommended under unavoidable circumstances such as rework. the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm. soldering the led using soldering iron tip closer than 1.59mm might damage the led. note: 1. pcb with diferent size and design (component density) will have diferent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to re-calibrate the soldering profle again before loading a new type of pcb. 2. avago technologies high brightness led are using high efciency led die with single wire bond as shown below. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250c and the solder contact time does not exceeding 3sec. over-stressing the led during soldering process might cause premature failure to the led due to delamination. avago technologies led confguration anode 1.59mm ? esd precaution must be properly applied on the soldering station and personnel to prevent esd damage to the led component that is esd sensitive. do refer to avago application note an 1142 for details. the soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. ? recommended soldering condition: wave soldering [1, 2] manual solder dipping pre-heatftemperature 05fcfmax. - preheatftime 60fsecfmax - peakftemperature 50fcfmax. 60fcfmax. dwellftime 3fsecfmax. 5fsecfmax note: 1) above conditions refers to measurement with thermocouple mounted at the bottom of pcb. 2) it is recommended to use only bottom preheaters in order to reduce thermal stress experienced by led. ? wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. customer is advised to perform daily check on the soldering profle to ensure that it is always conforming to recommended soldering conditions. note: electrical connection between bottom surface of led die and the lead frame is achieved through conductive paste. ? any alignment fxture that is being applied during wave soldering should be loosely ftted and should not apply weight or force on led. non metal material is recommended as it will absorb less heat during wave soldering process. note: in order to further assist customer in designing jig accurately that ft avago technologies product, 3d model of the product is available upon request. ? at elevated temperature, led is more susceptible to mechanical stress. therefore, pcb must allowed to cool down to room temperature prior to handling, which includes removal of alignment fxture or pallet. ? if pcb board contains both through hole (th) led and other surface mount components, it is recommended that surface mount components be soldered on the top side of the pcb. if surface mount need to be on the bottom side, these components should be soldered using refow soldering prior to insertion the th led. ? recommended pc board plated through holes (pth) size for led component leads. led component lead size diagonal plated through hole diameter 0.45fxf0.45fmm (0.08xf0.08finch) 0.636fmm (0.05finch) 0.98ftof .08fmm (0.039ftof0.043finch) 0.50fxf0.50fmm (0.00xf0.00finch) 0.707fmm (0.08finch) .05ftof.5fmm (0.04 ftof0.045finch) ? over-sizing the pth can lead to twisted led after clinching. on the other hand under sizing the pth can cause difculty inserting the th led.
0 note: the ammo-packs drawing is applicable for packaging option Cdd & -zz and regardless standof or non-standof ammo packs drawing example of wave soldering temperature profle for th led 0 10 20 30 40 50 60 70 80 90 100 250 200 150 100 50 time (minutes) preheat turbulent wave laminar wave hot air knife recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin flux solder bath temperature: 245c 5c (maximum peak temperature = 250c) dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) note: allow for board to be sufficiently cooled to room temperature before exerting mechanical force. refer to application note an5334 for more information about soldering and handling of high brightness th led lamps. 18.00 0.50 (0.7087 0.0197) 6.35 1.30 (0.25 0.0512) 12.70 1.00 (0.50 0.0394) 9.125 0.625 (0.3593 0.025) 12.70 0.30 (0.50 0.0118) cathode 0.70 0.20 (0.0276 0.0079) 20.5 1.00 (0.8071 0.0394) a a view a-a ?
note: for ingan device, the ammo pack packaging box contain esd logo packaging box for ammo packs packaging label (i) avago mother label: (available on packaging box of ammo pack and shipping box) ( 1 p ) i t e m : p a r t n u m b e r ( 1 t ) l o t : l o t n u m b e r l p n ( 9 d ) m f g d a t e : m a n u f a c t u r i n g d a t e ( p ) c u s t o m e r i t e m : ( v ) v e n d o r i d m a d e i n : c o u n t r y o f o r i g i n ( q ) q t y : q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n r e v : d e p t i d : s t a n d a r d l a b e l l s 0 0 0 2 r o h s c o m p l i a n t e 1 m a x t e m p 2 5 0 c
acronyms and defnition: bin: (i) color bin only or vf bin only (applicable for part number with color bins but without vf bin or part number with vf bins and no color bin) or (ii) color bin incorporated with vf bin (applicable for part number that have both color bin and vf bin) (ii) avago baby label (only available on bulk packaging) example: (i) color bin only or vf bin only bin: 2 (represent color bin 2 only) bin: vb (represent vf bin vb only) (ii) color bin incorporate with vf bin bin: 2vb vb: vf bin vb 2: color bin 2 only disclaimer avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, expense or liability in connection with such use. p a r t # : p a r t n u m b e r l o t # : l o t n u m b e r m f g d a t e : m a n u f a c t u r i n g d a t e c / o : c o u n t r y o f o r i g i n c u s t o m e r p / n : s u p p l i e r c o d e : q u a n t i t y : p a c k i n g q u a n t i t y c a t : i n t e n s i t y b i n b i n : r e f e r t o b e l o w i n f o r m a t i o n d a t e c o d e : d a t e c o d e r o h s c o m p l i a n t e 1 m a x t e m p 2 5 0 c forfproductfinformationfandfafcompleteflistfoffdistributors,fpleasefgoftofourfwebfsite:fffffffff www.avagotech.com avago,favagoftechnologies,fandfthefaflogofareftrademarksfoffavagoftechnologies,flimitedfinfthefunitedfstatesfandfotherfcountries. datafsubjectftofchange.ffcopyrightf?f 007favagoftechnologiesflimited.fallfrightsfreserved.ff av0 -0530enf-fjunef6,f007

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